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Plasma Treatment cleans, etches and functionalizes plastic and metal surfaces to improve adhesion. Enercon plasma treatment solutions may be configured for a wide variety of industrial pretreatment applications. The examples below highlight many industries where in-line plasma treating is used to improve through put and product quality.
To see if Enercon plasma treatment technology is right for your application, contact us for more information or to schedule a free application trial.
Microporous membrane materials such as battery separators which are treated by Plasma3™ have enhanced hydrophilicity and wickability, significantly improving the efficiency of the battery cell.
Plasma3™ provides a surface cleaning and activation solution for roll to roll photovoltaic applications. Atmospheric plasma surface treatment systems provide an in-line solution to economically improve adhesion for films, foils and sheets. It is ideal for use prior to coating, laminating and deposition processes. It is highly effective at treating a wide range of substrates including Aluminum, Copper, Stainless Steel, EVA Film, ITO Film, PEN Film, PET Film, Polyimide Film and Glass. Learn more about atmospheric plasma surface treatment for photovoltaic applications.
Plasma3™ cleans and functionalizes polyester, polyimide, copper and stainless steel layer components by combining ion and electron bombardment with reactive plasma chemistries. Activation of Plasma3™ gas chemistries combined with UV energy volatilizes and removes surface contaminants while simultaneously raising surface energy and modifying surface functional groups.
Cleans copper and stainless steel layer components of PCBs before liquid photoresist coating with ion and electron bombardment after the etching process. Plasma3 is removing rolling oils and other surface contaminations from aluminium and steel foils prior to slitting and rewinding. Activation of Plasma3™ gas chemistries combined with UV energy to create a chemical reaction with the surface contaminants, resulting in their volatilization and removal. Learn more about plasma treatment for PCBs.
Plasma3™ is removing printed conductive ink or stamped foil debris from the chip site for clean contact with the antennae leads. It also functionalizes the entire surface of the RFID inlay for adhesion to film and/or paper label layers. Learn more about plasma treatment for RFID tags.
Uniquely conductive to treating these materials, Plasma3 is increasing the surface tension of closed cell foams to improve lamination adhesion to films without pinholing.
Flexible packaging converters utilizing aqueous inks on polyester-based structures may experience improvements in ink adhesion by employing APT-based surface treatment systems. Learn more about atmospheric plasma treatment for flexible packaging.
Atmospheric PECVD operates at atmospheric pressure and ambient temperature, allowing the use of a wide range of liquid precursors delivering high vapor coating rates onto flexible and rigid substrates. The process is currently being researched to deposit functionalities such as anti-fog, lubricity, corrosion resistance and electrical resistance.
Plasma3 technology envelops and cleans the fibers of woven and nonwoven structures to significantly enhance their wettability, printability, dyeability and fiber capillarity (faster dye/ink uptake). Significant improvements in the ink adhesion, dyeing depth and colorfastness of textile webs, yarns and filaments have been achieved, along with the pre-sterilization of various medical-grade textiles. Learn more about plasma treating nonwoven textiles.
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