Pretreatment Solutions for Improving Adhesion in Electronics Applications

Blown ion plasma and flame plasma are effective and repeatable treatment methods that take the guesswork out of electronics manufacturing bonding processes.

It is imperative that manufacturers protect these electronics from moisture, corrosion, contamination, static, and mechanical shock. To prevent damage, electronics such as printed circuit boards (PCBs) are typically protected with coatings. Additional protection methods include potting for critical electrical components and placing electronic components in housings that provide waterproof seals.

This article, first seen in ASI Magazine, discusses the benefits of plasma surface treatment in creating strong adhesion bonds for electronic applications.